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- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Suche
DIN EN 62047-12
Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
DIN EN 62047-10
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (IEC 62047-10:2011); German version EN 62047-10:2011
DIN EN 62047-9
Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS (IEC 62047-9:2011); German version EN 62047-9:2011
DIN EN 62047-8
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films (IEC 62047-8:2011); German version EN 62047-8:2011
DIN EN 62047-7
Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection (IEC 62047-7:2011); German version EN 62047-7:2011
DIN EN 62047-4
Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS (IEC 62047-4:2008); German version EN 62047-4:2010
DIN EN 62047-5
Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches (IEC 62047-5:2011); German version EN 62047-5:2011
DIN EN 62047-6
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
DIN EN 62040-4
Uninterruptible power systems (UPS) - Part 4: Environmental aspects - Requirements and reporting (IEC 62040-4:2013); German version EN 62040-4:2013
DIN EN 62047-3
Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile-testing (IEC 62047-3:2006); German version EN 62047-3:2006





