News
- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Suche
DIN EN IEC 60204-32
Safety of machinery - Electrical equipment of machines - Part 32: Requirements for hoisting machines (IEC 60204-32:2023); German version EN IEC 60204-32:2025
DIN EN 60204-31
Safety of machinery - Electrical equipment of machines - Part 31: Particular safety and EMC requirements for sewing machines, units and systems (IEC 60204-31:2013); German version EN 60204-31:2013
DIN EN IEC 60204-11
Safety of machinery - Electrical equipment of machines - Part 11: Requirements for equipment for voltages above 1 000 V AC or 1 500 V DC and not exceeding 36 kV (IEC 60204-11:2018); German version EN IEC 60204-11:2019
DIN EN 60204-1
Safety of machinery - Electrical equipment of machines - Part 1: General requirements (IEC 60204-1:2016, modified); German version EN 60204-1:2018
DIN EN 60196
IEC-Normfrequenzen (IEC 60196:2009); Deutsche Fassung EN 60196:2009
IEC standard frequencies (IEC 60196:2009); German version EN 60196:2009
DIN EN 60195
Method of measurement of current noise generated in fixed resistors (IEC 60195:2016); German version EN 60195:2016
DIN EN 60192
Low-pressure sodium vapour lamps - Performance specifications (IEC 60192:2001); German version EN 60192:2001
DIN EN 60191-6-22
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
DIN EN 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
DIN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010





