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Anzahl der Treffer (Daten werden monatlich aktualisiert): 48014
Weiter Weiter| 9251 - 9260 | 9261 - 9270|9271 - 9280 |Weiter Weiter

GB/T 8358-2023

钢丝绳 破断拉力测定方法

Steel wire ropes—Determination of breaking force

GB/T 10815-2023

日用精陶器

Domestic fine pottery

GB/T 42432-2023

航天器吊装通用要求

General requirements of hoisting for spacecraft

GB/T 42435-2023

海岸侵蚀监测与灾害损失评估技术规范

Technical specification for coastal erosion monitoring and disaster losses evaluation

GB/T 42434-2023

飞机恒压变量液压泵通用规范

General specification for aerospace variable delivery,pressure compensated, hydraulic pumps

GB/T 17626.11-2023

电磁兼容 试验和测量技术 第11部分:对每相输入电流小于或等于16 A设备的电压暂降、短时中断和电压变化抗扰度试验

Electromagnetic compatibility—Testing and measurement techniques—Part 11:Voltage dips, short interruptions and voltage variations immunity tests for equipment with input current up to 16 A per phase

GB/T 6683.3-2023

石油及相关产品 测量方法与结果精密度 第3部分:试验方法已发布精密度数据的监测和验证

Petroleum and related products—Precision of measurement methods and results—Part 3: Monitoring and verification of published precision data in relation to methods of test

GB/T 43579-2023

区块链和分布式记账技术 智能合约生命周期管理技术规范

Blockchain and distributed ledger technology—Technical specification of smart contract lifecycle management

GB/T 15092.3-2023

器具开关 第2-5部分:转换选择器的特殊要求

Switches for appliances—Part 2-5: Particular requirements for change-over selectors

GB/T 15879.604-2023

半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列(BGA)封装的尺寸测量方法

Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)

Anzahl der Treffer (Daten werden monatlich aktualisiert): 48014
Weiter Weiter| 9251 - 9260 | 9261 - 9270|9271 - 9280 |Weiter Weiter