News
- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
Suche
DIN EN 60512-12-6
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996
DIN EN 60512-12-5
Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method (IEC 60512-12-5:2006); German version EN 60512-12-5:2006
DIN EN 60512-12-4 Berichtigung 1
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006); German version EN 60512-12-4:2006, Corrigendum to DIN EN 60512-12-4:2006-11; German version CENELEC-Cor.:2006 to EN 60512-12-4:2006
DIN EN 60512-12-4
Connectors for electronic equipment - Tests and measurements - Part 12-4: Soldering tests - Test 12d: Resistance to soldering heat, solder bath method (IEC 60512-12-4:2006); German version EN 60512-12-4:2006
DIN EN 60512-12-3 Berichtigung 1
Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006, Corrigendum to DIN EN 60512-12-3:2006-11; German version CENELEC-Cor.:2006 to EN 60512-12-3:2006
DIN EN 60512-12-3
Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006
DIN EN 60512-6-1
Connectors for electronic equipment - Tests and measurements - Part 6-1: Dynamic stress tests; Test 6a: Acceleration, steady state (IEC 60512-6-1:2002); German version EN 60512-6-1:2002
DIN EN 60512-6-2
Connectors for electronic equipment - Tests and measurements - Part 6-2: Dynamic stress tests; Test 6b: Bump (IEC 60512-6-2:2002); German version EN 60512-6-2:2002
DIN EN 60512-12-2 Berichtigung 1
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method (IEC 60512-12-2:2006); German version EN 60512-12-2:2006, Corrigendum to DIN EN 60512-12-2:2006-11; German version CENELEC-Cor.:2006 to EN 60512-12-2:2006
DIN EN 60512-12-2
Connectors for electronic equipment - Tests and measurements - Part 12-2: Soldering tests - Test 12b: Solderability, wetting, soldering iron method (IEC 60512-12-2:2006); German version EN 60512-12-2:2006





