News
- 13.05.2019 ISO/TS 19807-2 "Nanotechnologies -- Magnetic nanomaterials -- Part 2: Specification of characteristics and measurements for nanostructured superparamagnetic beads for nucleic acid extraction
- 01.12.2016 Industrie 4.0: Deutsch-Chinesische Zusammenarbeit nimmt Fahrt auf
- 15.11.2016 Deutsch-chinesisches Seminar in Chengdu
Links
- BAM - Bundesanstalt für Materialforschung und -prüfung
- DIN Media - DIN Media GmbH
- BMWK - Bundesministerium für Wirtschaft und Klimschutz
- DIN - Deutsches Institut für Normung
- PTB - Physikalisch-Technische Bundesanstalt
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GB/T 26237.14-2023
Information technology — Biometric data interchange formats— Part 14:DNA data
GB/T 42709.7-2023
半导体器件 微电子机械器件 第7部分:用于射频控制和选择的MEMS体声波滤波器和双工器
Semiconductor devices—Micro-electromechanical devices—Part 7: MEMS BAW filter and duplexer for radio frequency control and selection
GB/T 17626.11-2023
电磁兼容 试验和测量技术 第11部分:对每相输入电流小于或等于16 A设备的电压暂降、短时中断和电压变化抗扰度试验
Electromagnetic compatibility—Testing and measurement techniques—Part 11:Voltage dips, short interruptions and voltage variations immunity tests for equipment with input current up to 16 A per phase
GB/T 6683.3-2023
石油及相关产品 测量方法与结果精密度 第3部分:试验方法已发布精密度数据的监测和验证
Petroleum and related products—Precision of measurement methods and results—Part 3: Monitoring and verification of published precision data in relation to methods of test
GB/T 42435-2023
Technical specification for coastal erosion monitoring and disaster losses evaluation
GB/T 42434-2023
General specification for aerospace variable delivery,pressure compensated, hydraulic pumps
GB/T 15092.3-2023
Switches for appliances—Part 2-5: Particular requirements for change-over selectors
GB/T 15879.604-2023
半导体器件的机械标准化 第6-4部分:表面安装半导体器件封装外形图绘制的一般规则 焊球阵列（BGA）封装的尺寸测量方法
Mechanical standardization of semiconductor devices—Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages—Measuring methods for package dimensions of ball grid array (BGA)